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60 pages • missing pub info (editions)
ISBN/UID: 9786139858248
Format: Paperback
Language: English
Publisher: LAP Lambert Academic Publishing
Publication date: 19 June 2018
Description
Face to Face Stacking on Wafer to Wafer (WoW) can be done for the Cu-Cu direct bonding interconnects. A good mechanical strength to sustain shear force during thinning can be achieved by Cu bonding. While making reliable interconnect structures ha...
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Content Warnings
60 pages • missing pub info (editions)
ISBN/UID: 9786139858248
Format: Paperback
Language: English
Publisher: LAP Lambert Academic Publishing
Publication date: 19 June 2018
Description
Face to Face Stacking on Wafer to Wafer (WoW) can be done for the Cu-Cu direct bonding interconnects. A good mechanical strength to sustain shear force during thinning can be achieved by Cu bonding. While making reliable interconnect structures ha...
Community Reviews
Content Warnings